Substrate processing apparatus and substrate processing method

ABSTRACT

A substrate processing apparatus includes a transfer block in which a transfer device configured to transfer a substrate is placed, and a processing block provided adjacent to the transfer block. The processing block includes a liquid film forming unit configured to form a liquid film on a top surface of the substrate which is held horizontally, and a drying unit configured to replace the liquid film with a supercritical fluid to dry the substrate. The drying unit includes a pressure vessel having therein a drying chamber for the substrate, a cover body configured to close an opening of the drying chamber, and a supporting body configured to support the substrate horizontally in the drying chamber. The supporting body is fixed to the drying chamber. The transfer device advances into the drying chamber through the opening of the drying chamber while holding horizontally the substrate having the liquid film thereon.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Japanese Patent Application No.2020-135142 filed on Aug. 7, 2020, the entire disclosure of which isincorporated herein by reference.

TECHNICAL FIELD

The various aspects and embodiments described herein pertain generallyto a substrate processing apparatus and a substrate processing method.

BACKGROUND

A drying apparatus described in Patent Document 1 dries a substrate byreplacing a liquid film formed on a top surface of the substrate, whichis held horizontally, with a supercritical fluid. This drying apparatusis equipped with a rectangular box-shaped vessel main body, a coverbody, and a substrate placing table. The cover body and the substrateplacing table also serve as a carry-in/out mechanism for carrying thesubstrate in/out, and are configured to be movable back and forth.Patent Document 2 also describes the same technique as described inPatent Document 1.

Patent Document 1: Japanese Patent Laid-open Publication No. 2013-254904

Patent Document 2: Japanese Patent Laid-open Publication No. 2019-067863

SUMMARY

In one exemplary embodiment, a substrate processing apparatus includes atransfer block in which a transfer device configured to transfer asubstrate is placed, and a processing block provided adjacent to thetransfer block. The processing block includes a liquid film forming unitconfigured to form a liquid film on a top surface of the substrate whichis held horizontally, and a drying unit configured to replace the liquidfilm with a supercritical fluid to dry the substrate. The drying unitincludes a pressure vessel having therein a drying chamber for thesubstrate, a cover body configured to close an opening of the dryingchamber, and a supporting body configured to support the substratehorizontally in the drying chamber. The supporting body is fixed to thedrying chamber. The transfer device advances into the drying chamberthrough the opening of the drying chamber while holding horizontally thesubstrate having the liquid film formed thereon.

The foregoing summary is illustrative only and is not intended to be anyway limiting. In addition to the illustrative aspects, embodiments, andfeatures described above, further aspects, embodiments, and featureswill become apparent by reference to the drawings and the followingdetailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

In the detailed description that follows, embodiments are described asillustrations only since various changes and modifications will becomeapparent to those skilled in the art from the following detaileddescription. The use of the same reference numbers in different figuresindicates similar or identical items.

FIG. 1 is a plan view of a substrate processing apparatus according toan exemplary embodiment;

FIG. 2 is a front view of the substrate processing apparatus accordingto the exemplary embodiment;

FIG. 3 is a side view of the substrate processing apparatus according tothe exemplary embodiment;

FIG. 4 is a flowchart illustrating a substrate processing methodaccording to the exemplary embodiment;

FIG. 5A to FIG. 5C are cross sectional views illustrating an example ofa standby position of a cover body, an example of an opening position ofthe cover body, and an example of a closing position of the cover body,respectively;

FIG. 6A is a horizontal cross sectional view illustrating an example ofa rectifying plate, and FIG. 6B and FIG. 6C are cross sectional viewstaken along lines B-B and C-C of FIG. 6A, respectively;

FIG. 7A and FIG. 7B are a horizontal cross sectional view and a verticalcross sectional view illustrating an example flow in a pressure-raisingoperation, respectively;

FIG. 8A and FIG. 8B are a horizontal cross sectional view and a verticalcross sectional view illustrating an example flow in a purgingoperation, respectively;

FIG. 9A is a side view illustrating a state of a drying unit when afluid is supplied, and FIG. 9B is a cross sectional view taken along aline B-B of FIG. 9A;

FIG. 10A is a side view illustrating a state of the drying unit when asubstrate is carried in or out, and FIG. 1013 is a cross sectional viewtaken along a line B-B of FIG. 10A;

FIG. 11A is a cross sectional view illustrating an example state at themoment when a lock key is begun to be raised, and FIG. 11B is a crosssectional view illustrating an example state at the moment when theraising of the lock key is ended;

FIG. 12 is a flowchart illustrating an example of a process S4 of FIG.4;

FIG. 13 is a plan view of a substrate processing apparatus according toa first modification example;

FIG. 14 is a front view of the substrate processing apparatus accordingto the first modification example;

FIG. 15 is a plan view of a substrate processing apparatus according toa second modification example;

FIG. 16 is a side view of the substrate processing apparatus accordingto the second modification example;

FIG. 17 is a plan view of a substrate processing apparatus according toa third modification example;

FIG. 18 is a front view of the substrate processing apparatus accordingto the third modification example; and

FIG. 19 is a plan view of a substrate processing apparatus according toa fourth modification example.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part of the description. In thedrawings, similar symbols typically identify similar components, unlesscontext dictates otherwise. Furthermore, unless otherwise noted, thedescription of each successive drawing may reference features from oneor more of the previous drawings to provide clearer context and a moresubstantive explanation of the current exemplary embodiment. Still, theexemplary embodiments described in the detailed description, drawings,and claims are not meant to be limiting. Other embodiments may beutilized, and other changes may be made, without departing from thespirit or scope of the subject matter presented herein. It will bereadily understood that the aspects of the present disclosure, asgenerally described herein and illustrated in the drawings, may bearranged, substituted, combined, separated, and designed in a widevariety of different configurations, all of which are explicitlycontemplated herein.

Hereinafter, exemplary embodiments will be described with reference tothe accompanying drawings. In the various drawings, same orcorresponding parts will be assigned same reference numerals, andredundant description thereof will be omitted. In the presentspecification, the X-axis direction, the Y-axis direction and the Z-axisdirection are orthogonal to each other. Further, the X-axis directionand the Y-axis direction are horizontal directions, whereas the Z-axisdirection is a vertical direction.

First, referring to FIG. 1 to FIG. 3, a substrate processing apparatus 1according to an exemplary embodiment will be described. As shown in FIG.1, the substrate processing apparatus 1 is equipped with a carry-in/outstation 2 and a processing station 3. The carry-in/out station 2 and theprocessing station 3 are provided adjacent to each other in the X-axisdirection.

The carry-in/out station 2 is equipped with a placing table 21, atransfer section 22, and a delivery section 23. A plurality of carriersC is placed on the placing table 21. Each of these carriers Caccommodates therein a multiple number of substrates W horizontallywhile maintaining a regular distance between the substrates W in avertical direction.

The substrate W may include a semiconductor substrate such as a siliconwafer or a compound semiconductor wafer, or a glass substrate. Thesubstrate W may further include a device such as an electronic circuitformed on a front surface of the semiconductor substrate or the glasssubstrate. The substrate W may have an irregularity pattern on the frontsurface thereof.

The transfer section 22 is provided adjacent to the placing table 21. Afirst transfer device 22 a is disposed within the transfer section 22.The first transfer device 22 a is configured to transfer the substratesW within the transfer section 22 to transfer the substrates W to/from aplurality of apparatuses disposed next to the transfer section 22.

The first transfer device 22 a includes a first transfer arm configuredto hold the substrate W. The first transfer arm is configured to bemoved in horizontal directions (both the X-axis direction and the Y-axisdirection) and the vertical direction, and is pivotable around avertical axis. The number of the first transfer arm may be one or more.

The delivery section 23 is provided adjacent to the transfer section 22.The delivery section 23 includes a transition device 23 a configured toaccommodate therein the substrates W temporarily. As illustrated in FIG.2, a plurality of transition devices 23 a may be stacked in the verticaldirection. Here, the layout and the number of the transition devices 23a are not particularly limited.

The processing station 3 is equipped with a transfer block 31 and aplurality of processing blocks 32. The transfer block 31 is providedadjacent to the delivery section 23. The transfer block 31 is of arectangular parallelepiped shape. A second transfer device 31 a isdisposed within the transfer block 31. The second transfer device 31 ais configured to transfer the substrates W between a plurality ofapparatuses disposed next to the transfer block 31.

The second transfer device 31 a includes a second transfer armconfigured to hold the substrate W. The second transfer arm isconfigured to be moved in the horizontal directions (both the X-axisdirection and the Y-axis direction) and the vertical direction, and ispivotable around a vertical axis. The number of the second transfer armmay be one or more.

The processing block 32 is disposed adjacent to the transfer block 31.The processing block 32 may be plural in number. As shown in FIG. 1, ifa plurality of processing blocks 32 are symmetrically arranged at bothsides of the transfer block 31 in the Y-axis direction, non-uniformityin processing time of the substrates W can be reduced between theprocessing blocks 32, so that non-uniformity in processing quality ofthe substrates W can be reduced. Further, as shown in FIG. 2, if theplurality of processing blocks 32 are stacked on top of each other inmultiple levels in the vertical direction, a footprint of the processingblocks 32 can be reduced. Here, however, the layout and the number ofthe processing blocks 32 are not particularly limited.

In case that the plurality of processing blocks 32 are stacked in themultiple levels in the vertical direction, a plurality of transferblocks 31 may also be stacked in multiple levels in the verticaldirection, as shown in FIG. 3. The number of the levels of the transferblocks 31 and the number of the levels of the processing blocks 32 aresame. In this configuration, multiple substrates W can be transferred atdifferent heights at the same time, so that the number of the substratesW processed per unit time can be increased. Here, however, the layoutand the number of the transfer blocks 31 are not particularly limited.

The processing block 32 includes a liquid film forming unit 32 a, adrying unit 32 b, and a supplying unit 32 c. The processing block 32 mayhave a plurality of (here, two) sets each including the liquid filmforming unit 32 a, the drying unit 32 b and the supplying unit 32 c. Aswill be described later, since the drying unit 32 b can be scaled downaccording to the present exemplary embodiment, the processing block 32can be scaled down even if the number of various units provided in theprocessing block 32 is increased.

The liquid film forming unit 32 a is configured to supply a liquid ontoa top surface of the substrate W horizontally held. The liquid filmforming unit 32 a includes, by way of example, a spin chuck configuredto hold the wafer W horizontally, and a nozzle configured to dischargethe liquid onto the top surface of the substrate W. The nozzle suppliesthe liquid onto a center of the top surface of the substrate W beingrotated. The liquid is diffused from the center of the top surface ofthe substrate W toward a periphery thereof by a centrifugal force. As anexample of the liquid, a chemical liquid, a rinse liquid and a dryingliquid are supplied in this sequence. Multiple kinds of chemical liquidsmay be supplied, and the rinse liquid may be supplied between the supplyof one chemical liquid and the supply of another chemical liquid.

In the liquid film forming unit 32 a, a liquid film of the chemicalliquid is formed on the top surface of the horizontally held substrateW; the liquid film of the chemical liquid is replaced by a liquid filmof the rinse liquid; and the liquid film of the rinse liquid is replacedby a liquid film of the drying liquid. The chemical liquid may be, byway of non-limiting example, SC1 (an aqueous solution of ammonia andhydrogen peroxide) or DHF (Dilute HydroFluoric acid). The rinse liquidmay be, by way of non-limiting example, DIW (Delonized Water). Thedrying liquid may be, by way of example, but not limitation, an organicsolvent such as IPA (IsoPropyl Alcohol).

The drying unit 32 b is configured to dry the substrate W by replacingthe liquid film formed on the top surface of the horizontally heldsubstrate W with a supercritical fluid. The supercritical fluid is afluid placed at a temperature above a threshold temperature, under apressure above a threshold pressure and in a state of beingundistinguishable between liquid and gas phases. By replacing the liquidfilm of the drying liquid or the like with the supercritical fluid, acollapse of the irregularity pattern of the substrate W, which is causedby a surface tension, can be suppressed. Details of the drying unit 32 bwill be discussed later.

The supplying unit 32 c is configured to supply a fluid to the dryingunit 32 b. To elaborate, the supplying unit 32 c is equipped with asupplying device group including a flowmeter, a flow rate controller, aback pressure valve and a heater, and has a housing accommodating thesupplying device group. The supplying unit 32 c supplies, for example,CO₂ into the drying unit 32 b as the fluid.

When viewed from the top, the liquid film forming units 32 a and thedrying units 32 b belonging to the same processing block 32 are arrangedalong a long side of the rectangular transfer block 31. The plurality ofliquid film forming units 32 a belonging to the same processing block 32are adjacent to each other and placed closer to the transition device 23a than the drying units 32 b are.

When viewed from the top, the drying units 32 b and the supplying units32 c belonging to the same processing block 32 are arranged alternatelyin the X-axis direction. Each supplying unit 32 c supplies the fluid tothe drying unit 32 b adjacent to the negative X-axis side thereof. Thesupplying units 32 c may or may not be placed adjacent to the transferblock 31, since the substrate W is not carried into/from the supplyingunit 32 c.

When viewed from the top, the processing block 32 is protruded more thanthe transfer block 31 in the positive X-axis direction. The supplyingunit 32 c is disposed in this protruding portion. Three sides (thepositive Y-axis side, the negative Y-axis side, and the positive X-axisside) of the supplying unit 32 c are open, which increases maintenanceworkability.

In case that the plurality of processing blocks 32 are provided, thesecond transfer device 31 a transfers the single substrate W betweenmultiple units (for example, the liquid film forming unit 32 a and thedrying unit 32 b) belonging to the same processing block 32. The secondtransfer device 31 a does not transfer the substrate W between theplurality of processing blocks 32.

The substrate processing apparatus 1 is equipped with a control device4. The control device 4 is, for example, computer, and includes a CPU(Central Processing Unit) 41 and a recording medium 42 such as a memory.The recording medium 42 stores therein a program for controlling variouskinds of processings performed in the substrate processing apparatus 1.The control device 4 controls an operation of the substrate processingapparatus 1 by allowing the CPU 41 to execute the program stored in therecording medium 42.

Now, an operation of the substrate processing apparatus 1 will bedescribed with reference to FIG. 4. Processes S1 to S4 shown in FIG. 4are performed under the control of the control device 4.

First, the first transfer device 22 a takes out the substrate W from thecarrier C, and transfers the taken substrate W into the transitiondevice 23 a. Then, the second transfer device 31 a takes out thesubstrate W from the transition device 23 a, and transfers the takensubstrate W into the liquid film forming unit 32 a.

Subsequently, the liquid film forming unit 32 a supplies the chemicalliquid onto the top surface of the substrate W which is horizontallyheld (process S1). The chemical liquid is supplied to the center of thetop surface of the substrate W being rotated, and diffused onto theentire top surface of the substrate W in a diametrical direction by thecentrifugal force, thus forming a liquid film.

Thereafter, the liquid film forming unit 32 a supplies the rinse liquidonto the top surface of the substrate W which is held horizontally(process S2). The rinse liquid is supplied to the center of the topsurface of the substrate W being rotated, and diffused onto the entiretop surface of the substrate W in the diametrical direction by thecentrifugal force, thus forming a liquid film. As a result, the liquidfilm of the chemical liquid is replaced by the liquid film of the rinseliquid.

Next, the liquid film forming unit 32 a supplies the drying liquid ontothe top surface of the substrate W which is held horizontally (processS3). The drying liquid is supplied to the center of the top surface ofthe substrate W being rotated, and diffused onto the entire top surfaceof the substrate W in the diametrical direction by the centrifugalforce, thus forming a liquid film. As a result, the liquid film of therinse liquid is replaced by the liquid film of the drying liquid.

Then, the second transfer device 31 a takes out the substrate W from theliquid film forming unit 32 a, and transfers the taken substrate W intothe drying unit 32 b.

Subsequently, the drying unit 32 b dries the substrate W by replacingthe liquid film formed on the top surface of the horizontally heldsubstrate W with the supercritical fluid (process S4). If the liquidfilm of the drying liquid or the like is replaced by the supercriticalfluid, appearance of an interface between the liquid and the gas at theirregularity pattern of the substrate W can be suppressed. As a result,generation of a surface tension can be suppressed, so that a collapse ofthe irregularity pattern can be suppressed.

Finally, the second transfer device 31 a takes out the substrate W fromthe drying unit 32 b, and transfers the taken substrate W into thetransition device 23 a. Then, the first transfer device 22 a takes outthe substrate W from the transition device 23 a, and puts the takensubstrate W in the carrier C.

Now, the drying unit 32 b will be explained with reference to FIG. 5A toFIG. 5C. The drying unit 32 b shown in FIG. 5A to FIG. 5C is disposed atthe positive Y-axis side of the transfer block 31. In the description ofthe drying unit 32 b, a carry-in direction of the substrate W into adrying chamber S (i.e., positive Y-axis direction in FIG. 5A to FIG. 5C)is regarded as the front side, and a carry-out direction of thesubstrate W from the drying chamber S (i.e., negative Y-axis directionin FIG. 5A to FIG. 5C) is regarded as the rear side.

The drying unit 32 b includes a pressure vessel 51 having therein thedrying chamber S for the substrate W; a cover body 52 configured toclose a first opening Sa of the drying chamber S; and a supporting body53 configured to hold the substrate W horizontally in the drying chamberS. The first opening Sa is a carry-in/out opening for the substrate W.The substrate W is carried into the drying chamber S through the firstopening Sa, and then carried out of the drying chamber S through thefirst opening Sa after it is dried in the drying chamber S.

The pressure vessel 51 includes, for example, a lower wall 51 a, anupper wall 51 b, a front wall 51 c, a rear wall 51 d, and a pair ofsidewalls 51 e and 51 f (see FIG. 6A to FIG. 6C, etc.), and has thedrying chamber S therein. The drying chamber S is of, for example, arectangular parallelepiped shape. The first opening Sa having arectangular shape is formed in the rear wall 51 d, and a second openingSb having a rectangular shape is formed in the front wall 51 c.

The cover body 52 is provided at the rear of the rear wall 51 d. Thecover body 52 is configured to be moved back and forth between a closingposition (see FIG. 5C) and an opening position (see, for example, FIG.5B). The closing position is a position where the cover body 52 closesthe first opening Sa. The opening position is located at the rear of theclosing position, and is a position where the cover body 52 opens thefirst opening Sa.

In Patent Documents 1 and 2, the supporting body 53 is fixed to thecover body 52 and moved back and forth along with the cover body 52. Thesupporting body 53 is not fixed to the drying chamber S, and thesupporting body 53 and the second transfer device 31 a deliver thesubstrate W at an outside of the pressure vessel 51. For the purpose, anarea for delivering the substrate W is provided at the outside of thepressure vessel 51.

In contrast, in the present exemplary embodiment, the supporting body 53is fixed to the pressure vessel 51 and is not moved back and forth alongwith the cover body 52. The supporting body 53 is fixed to the dryingchamber S, and the second transfer device 31 a and the supporting body53 deliver the substrate W in the drying chamber S. Thus, since the areafor delivering the substrate W need not be provided at the outside ofthe pressure vessel 51, the drying unit 32 b can be scaled down.

Further, according to the present exemplary embodiment, the supportingbody 53 is fixed to the drying chamber S. Thus, unlike the case wherethe supporting body 53 is moved back and forth with respect to thepressure vessel 51, there occurs no backlash between sliding components.As a result, vibration of the supporting body 53 and vibration of thesubstrate W can be suppressed, so that an overflow of a liquid film LFcan be suppressed.

The first opening Sa of the drying chamber S is formed toward thetransfer block 31, unlike in Patent Documents 1 and 2. Thus, it ispossible to carry the substrate W into the drying chamber S withoutneeding to rotate the second transfer arm of the second transfer device31 a around the vertical axis. Since the substrate W can be carried intothe drying chamber S without needing to be rotated, scattering of thedrying liquid off the top surface of the substrate W can be avoided.

The cover body 52 is rotated between the opening position and a standbyposition (see FIG. 5A) to allow the second transfer device 31 a toaccess the drying chamber S easily. The standby position is a positiondeviated from a carry-in/out path of the substrate W. When the substrateW is carried in or out, the cover body 52 stands by at the standbyposition. Accordingly, interference between the cover body 52 and thesubstrate W can be avoided.

The supporting body 53 includes, as illustrated in FIG. 6A to FIG. 6C, arectifying plate 53 a configured to rectify a flow of the fluid in thedrying chamber S; and a placing member 53 b fixed to a top surface ofthe rectifying plate 53 a. The rectifying plate 53 a is fixed to thedrying chamber S. The substrate W is placed on the placing member 53 b.

As depicted in FIG. 6B, the placing member 53 b forms a gap between thesubstrate W and the rectifying plate 53 a to suppress contamination of abottom surface of the substrate W. The placing member 53 b includes, byway of example, a plurality of supporting pins. These supporting pinssupport the bottom surface of the substrate W here. However, thesupporting pins may be configured to support an edge of the substrate W.

The rectifying plate 53 a is formed to have a U-shape when viewed fromthe first opening Sa of the drying chamber S, and includes a horizontalplate 53 a 1 placed at the lower wall 51 a of the pressure vessel 51,and a pair of vertical plates 53 a 2 and 53 a 3 provided at both ends ofthe horizontal plates 53 a 1 in the X-axis direction. The verticalplates 53 a 2 and 53 a 3 are respectively fixed to the side walls 51 eand 51 f of the pressure vessel 51. By way of example, each of thevertical plates 53 a 2 and 53 a 3 is provided with a screw hole. Screwsare inserted into the screw holes of the vertical plates 53 a 2 and 53 a3 and screw holes of the sidewalls 51 e and 51 f, respectively, thusallowing the rectifying plate 53 a to be fixed to the pressure vessel51.

As shown in FIG. 6A, when viewed from the top, the rectifying plate 53 ahas a drain opening 53 a 4 at an outside of the substrate W supported bythe supporting body 53. The drain opening 53 a 4 is a hole through whichthe fluid is drained from above the rectifying plate 53 a to below it.Depending on the position of the drain opening 53 a 4, a flow of thefluid in the drying chamber S is defined. For example, the drain opening53 a 4 is provided at a rear end edge of the horizontal plate 53 a 1 ina straight line shape. A length of the drain opening 53 a 4 is largerthan a diameter of the substrate W.

When viewed from the top, the rectifying plate 53 a also has a supplyopening 53 a 5 at an outside of the substrate W supported by thesupporting body 53. The supply opening 53 a 5 is a hole through whichthe fluid is supplied from below the rectifying plate 53 a to above it.Depending on the position of the supply opening 53 a 5, a flow of thefluid in the drying chamber S is defined. The supply opening 53 a 5 maybe plural in number. For example, multiple supply openings 53 a 5 areprovided at each of four corners of the horizontal plate 53 a 1. Theposition and the number of the supply openings 53 a 5 are notparticularly limited. By way of another example, multiple openings 53 a5 may be arranged in a ring shape along the circumference of thesubstrate W.

As depicted in FIG. 6C, the pressure vessel 51 includes a drain port 51g for draining the fluid from the drying chamber S; and a supply port 51h for supplying the fluid into the drying chamber S. The drain port 51 gand the supply port 51 h are formed in the lower wall 51 a of thepressure vessel 51. The rectifying plate 53 a is placed on the lowerwall 51 a.

A first path CH1 connecting the drain opening 53 a 4 and the drain port51 g and a second path CH2 connecting the supply opening 53 a 5 and thesupply port 51 h are independently formed at a bottom surface of therectifying plate 53 a. The first path CH1 and the second path CH2 aregrooves formed on the bottom surface of the rectifying plate 53 a. Sincethe first path CH1 and the second path CH2 are not connected, thedraining of the fluid from the drying chamber S and the supplying of thefluid into the drying chamber S can be performed separately.

For example, the supply port 51 h is formed at a center of the lowerwall 51 a. The second path CH2 is radially formed from a center of therectifying plate 53 a toward the four corners thereof, for example.Since the distance from the center of the rectifying plate 53 a to eachof the four corners thereof is same, it is possible to distribute thefluid toward the four corners of the rectifying plate 53 a in a uniformmanner.

Meanwhile, the drain port 51 g is formed at the rear of the supply port51 h. The first path CH1 is formed so as not to be connected with thesecond path CH2, and is formed in a straight line shape backwards fromthe drain port 51 g. The drain opening 53 a 4 is provided at the rear ofthe drain port 51 g.

As illustrated in FIG. 9A to FIG. 10B, the drying unit 32 b is equippedwith a support frame 54 supporting the pressure vessel 51. The supportframe 54 includes, for example, a horizontal base plate 54 a, aplurality of pillars 54 b protruding upwards from the base plate 54 a,and a pair of horizontal plates 54 c fixed to top surfaces of theplurality of pillars 54 b. The horizontal plates 54 c are arranged at adistance therebetween in the X-axis direction. The pressure vessel 51 isfixed on the pair of horizontal plates 54 c.

The drying unit 32 b is equipped with a linearly moving mechanism 55configured to move the cover body 52 back and forth between the closingposition and the opening position; and a rotating mechanism 56configured to rotate the cover body 52 between the opening position andthe standby position. The rotating mechanism 56 includes, for example,rotation shafts 56 a of the cover body 52 and a rotary actuator 56 bconfigured to rotate the rotation shafts 56 a. Meanwhile, the linearlymoving mechanism 55 includes sliders 55 a configured to hold bearings ofthe rotation shafts 56 a, and a linearly moving actuator 55 b configuredto move the sliders 55 a back and forth.

The rotation shafts 56 a of the cover body 52 are symmetrically arrangedin the X-axis direction with the cover body 52 therebetween. The sliders55 a are also symmetrically arranged in the X-axis direction with thecover body 52 therebetween. Guides 55 c of the sliders 55 a arerespectively mounted to the pair of horizontal plates 54 c. The rotaryactuator 56 b is fixed to one of the sliders 55 a and moved back andforth along with this slider 55 a. The linearly moving actuator 55 b isfixed to one of the horizontal plates 54 c.

The linearly moving actuator 55 b is, by way of non-limiting example, apneumatic cylinder, and serves to press the cover body 52 against thepressure vessel 51 by using a pressure of compressed air. Anon-illustrated seal member for sealing a gap between the cover body 52and the pressure vessel 51 can be pressed by a driving force of thelinearly moving actuator 55 b, so that the cover body 52 can besuppressed from obstructing a movement of a lock key 57 to be describedlater when the lock key 57 is fitted into an insertion hole 51 i of theupper wall 51 b of the pressure vessel 51. Further, the linearly movingactuator 55 b may include a motor, and a ball screw configured toconvert a rotary motion of the motor into a linear motion of the coverbody 52.

The drying unit 32 b is equipped with the lock key 57 configured torestrict the cover body 52 from being retreated from the closingposition toward the opening position. The lock key 57 is fitted into theinsertion hole 51 i of the pressure vessel 51 to thereby restrict theretreat of the cover body 52. Thus, even when the pressure of the dryingchamber S is increased as a result of supplying the fluid into thedrying chamber S, the retreat of the cover body 52 can be restricted, sothat a leak of the fluid can be suppressed.

The insertion hole 51 i is formed through the lower wall 51 a and theupper wall 51 b in the Z-axis direction. The lower wall 51 a and theupper wall 51 b protrude backwards more than the rear wall 51 d. Theinsertion hole 51 i is formed in these protruding portions of the lowerwall 51 a and the upper wall 51 b. The insertion hole 51 i is plural innumber, and these insertion holes 51 i are arranged at a regulardistance therebetween in the X-axis direction. The lock key 57 is pluralin number as well, and these lock keys 57 are arranged at a regulardistance therebetween in the X-axis direction. Each of these lock keys57 is inserted into the corresponding insertion hole 51 i of the lowerwall 51 a and the corresponding insertion hole 51 i of the upper wall 51b.

Though the number of the lock keys 57 is not particularly limited, itmay be three, for example. If three lock keys 57 are provided, a centralportion of the cover body 52 in the X-axis direction can also bepressed, unlike a case where only two lock keys 57 are provided. As aresult, when increasing the pressure of the drying chamber S bysupplying the fluid into the drying chamber S, the central portion ofthe cover body 52 in the X-axis direction can be suppressed from beingprojected backwards more than an end portion of the cover body 52 in theX-axis direction.

The drying unit 32 b is equipped with a film thickness gauge 58configured to measure a film thickness of the liquid film LF formed onthe top surface of the substrate W. The film thickness gauge 58 measuresthe film thickness of the liquid film LF by radiating laser to thesubstrate W from the insertion hole 51 i of the pressure vessel 51 (morespecifically, the upper wall 51 b). By way of example, the filmthickness gauge 58 measures the film thickness of the liquid film LF bymeasuring a phase difference between reflection light reflected on a topsurface of the liquid film LF and reflection light reflected at aninterface between the liquid film LF and the substrate W. A coatingstate of the substrate W by the liquid film LF can be inspected, and,thus, it can be checked whether the irregularity pattern of thesubstrate W is covered with the liquid film LF. A maximum thickness ofthe liquid film LF needs to be larger than a height difference of theirregularity pattern.

The insertion hole 51 i of the pressure vessel 51 is formed near thefirst opening Sa of the drying chamber S. Since the film thickness gauge58 radiates the laser to the substrate W from the insertion hole 51 i,the film thickness gauge 58 is capable of measuring the film thicknessof the liquid film LF immediately before the substrate W is accommodatedin the drying chamber S. Thus, it is possible to inspect the coatingstate of the substrate W by the liquid film LF immediately before theliquid film LF is replaced by the supercritical fluid. Since the dryingliquid is an organic solvent having high volatility, the film thicknessof the liquid film LF needs to be measured immediately before the entiresubstrate W is accommodated in the drying chamber S.

The film thickness gauge 58 measures the film thickness of the liquidfilm LF while carrying the substrate W into the drying chamber S by thesecond transfer device 31 a. The film thickness gauge 58 may measure thefilm thickness repeatedly while varying multiple measurement points ofthe film thickness with the second transfer device 31 a. Since the filmthickness of the liquid film LF can be measured at the multiplemeasurement points, the entire top surface of the substrate W can beinspected.

The drying unit 32 b is equipped with an elevating mechanism 59configured to move the lock key 57 between a locking position (see FIG.9B) and a lock releasing position (see FIG. 10B). The locking positionis a position where the lock key 57 restricts a retreat of the coverbody 52 and where the lock keys 57 are inserted into the insertion holes51 i of the upper wall 51 a and the lower wall 51 b. The lock releasingposition is a position where the lock key 57 allows the retreat of thecover body 52 and where the lock key 57 is pulled downwards from theinsertion hole 51 i of the upper wall 51 b. The lock releasing positionis set under the carry-in/out path of the substrate W to suppressinterference between the lock key 57 and the substrate W.

The elevating mechanism 59 includes, by way of example, an elevationtable 59 a on which the plurality of lock keys 57 are placed; and alinearly moving actuator 59 b configured to move the elevation table 59a up and down. The elevation table 59 a has a horizontal surface 59 a 1on which the lock keys 57 are placed. The linearly moving mechanism 59 bis, by way of non-limiting example, a pneumatic cylinder, and serves tomove the elevation table 59 a up and down, thus allowing the lock keys57 to be moved up and down. The linearly moving actuator 59 b mayinclude a motor and a ball screw configured to convert a rotary motionof the motor into a linear motion of the elevation table 59 a.

As shown in FIG. 11A and FIG. 11B, the drying unit 32 b may be equippedwith rolling bodies 60 mounted to the lock key 57 in a rollable manner.The rolling bodies 60 may be, by way of non-limiting example, balls, andthey are pivotable around the centers thereof. As another example, therolling bodies 60 may be rollers.

When the elevating mechanism 59 raises the lock key 57 from the lockreleasing position to the locking position, the rolling bodies 60 rollin contact with the cover body 52 or the pressure vessel 51. The rollingbodies 60 can reduce friction resistance, thus inhibiting particlegeneration that might be caused by friction.

Multiple rolling bodies 60 may be provided at a bottom surface 57 a ofthe lock key 57 as well, unlike in Patent Document 2. The rolling bodies60 at the bottom surface 57 a of the lock key 57 roll in contact withthe horizontal surface 59 a 1 of the elevating mechanism 59. When thelock key 57 is raised, the lock key 57 can be horizontally moved withinthe insertion hole 51 i, so that the friction resistance can be reduced.

The lock key 57 may be moved up and down with a rear surface 57 bstanding upright. If the lock key 57 is raised with the rear surface 57b tilted forwards as in Patent Document 2, an edge 57 c of a top surfacefront end of the lock key 57 may be collided with a rear surface 52 a ofthe cover body 52.

Multiple rolling bodies 60 are arranged at the rear surface 57 b of thelock key 57 at a regular distance therebetween in the Z-axis direction,unlike in Patent Document 2. As compared to a case where only onerolling body is provided thereat, the friction between the lock key 57and the pressure vessel 51 can be reduced. This effect is especiallyconspicuous when the rear surface 57 b of the lock key 57 is maintainedupright.

The lock key 57 may have, on a front surface thereof, an inclinedsurface 57 d inclined forwards as it goes downwards from an upper endthereof; and a vertical surface 57 e extending directly downwards from alower end of the inclined surface 57 d. By providing the inclinedsurface 57 d, the edge 57 c of the top surface front end of the lock key57 can be suppressed from being collided with the rear surface 52 a ofthe cover body 52.

A rolling body 60 may be provided at the inclined surface 57 d of thelock key 57 as well, and it rolls in contact with the rear surface 52 aof the cover body 52. The rear surface 52 a of the cover body 52 facesthe inclined surface 57 d of the lock key 57 and is inclined forwards asit goes downwards from an upper end thereof.

Now, details of the process S4 will be discussed with reference to FIG.12. Processes S41 to S45 shown in FIG. 12 are performed under thecontrol of the control device 4.

First, the second transfer device 31 a horizontally holds the substrateW having the liquid film LF of the drying liquid formed thereon, andcarries the substrate W into the drying chamber S within the pressurevessel 51 (process S41). In this process, the film thickness gauge 58measures the film thickness of the liquid film LF. It can be checkedwhether the irregularity pattern of the substrate W is covered with theliquid film LF.

Then, the supporting body 53 fixed to the drying chamber S receives thesubstrate W from the second transfer device 31 a, and holds the receivedsubstrate W horizontally. Thereafter, the second transfer device 31 a isretreated to the outside of the drying chamber S through the firstopening Sa of the drying chamber S.

Subsequently, the rotating mechanism 56 rotates the cover body 52 fromthe standby position to the opening position. Then, the linearly movingmechanism 55 moves the cover body 52 forwards from the opening positionto the closing position. As a result, the cover body 52 closes the firstopening Sa of the drying chamber S.

Then, the elevating mechanism 59 raises the lock keys 57 from the lockreleasing position to the locking position. The lock keys 57 press thecover body 52 from the backside thereof, thus restricting the cover body52 from being retreated. Thus, in a process S42 to be described later, aleak of a fluid can be suppressed.

Next, the supplying unit 32 c supplies the fluid such as CO₂ into thedrying chamber S, thus raising the pressure of the drying chamber S(process S42). The fluid is supplied into the drying chamber S from thesupply port 51 h of the lower wall 51 a, as shown in FIG. 7B. The fluidis discharged upwards from the supply openings 53 a 5 of the rectifyingplate 53 a. When viewed from the top, the multiple supply openings 53 a5 are formed at each of the four corners of the rectifying plate 53 a,as shown in FIG. 7A, and the fluid flows from an outer side of thesubstrate W toward an inner side thereof. A flow of the fluid headingtoward the center of the substrate W from the periphery thereof isformed above the substrate W. This flow of the fluid suppresses theoutflow of the liquid film LF to the outside of the substrate W. Whenviewed from the top, since the supply openings 53 a 5 are positioned atthe outer side than the substrate W, the substrate W does not rattleeven if the supply openings 53 a 5 discharge the fluid directly upwards.While increasing the pressure of the drying chamber S, the fluid is notdrained from the drying chamber S but collected in the drying chamber S.The pressure of the drying chamber S is raised up to a set pressureequal to or higher than a threshold pressure.

Then, the supplying unit 32 c supplies the fluid into the drying chamberS, and a non-illustrated drain unit drains the fluid from the dryingchamber S, and purging the drying liquid dissolved in the fluid in thesupercritical state is performed while keeping the pressure of thedrying chamber S at the set pressure (process S43). At this time, thefluid is supplied into the drying chamber S from a discharge port 61 aof a second cover body 61, as illustrated in FIG. 8B. The second coverbody 61 is configured to close the second opening Sb of the dryingchamber S, and is disposed to face the cover body 52. The dischargeopening 61 a of the second cover body 61 is plural in number, and thesedischarge openings 61 a are arranged at a regular distance therebetweenin the X-axis direction, as shown in FIG. 8A, to form a curtain-shapedflow above the substrate W. The fluid dissolves the drying liquid of theliquid film LF while it is passing through a space above the substrateW. After passing through the space above the substrate W, the fluidhaving the drying liquid dissolved therein passes through the drainopening 53 a 4 of the rectifying plate 53 a and is drained to theoutside of the drying chamber S. As a result, the liquid film LF isreplaced by the supercritical fluid.

Subsequently, the supplying unit 32 c stops the supply of the fluid intothe drying chamber S, and the non-illustrated drain unit drains thefluid from the drying chamber S, thus reducing the pressure of thedrying chamber S (process S44). The drain unit may include a vacuum pumpor an ejector to shorten a time required for the decompression. Thepressure of the drying chamber S is reduced to about an atmosphericpressure.

Then, the elevating mechanism 59 lowers the lock keys 57 from thelocking position to the lock releasing position.

Then, the linearly moving mechanism 55 retreats the cover body 52 fromthe closing position to the opening position. Next, the rotatingmechanism 56 rotates the cover body 52 from the opening position to thestandby position.

Afterwards, the second transfer device 31 a advances into the dryingchamber S of the pressure vessel 51, receives the substrate W from thesupporting body 53, and takes out the received substrate W (processS45).

Now, a first modification example of the substrate processing apparatus1 will be explained with reference to FIG. 13 and FIG. 14. Below, thedescription will mainly focus on distinctive features between thepresent modification example and the above-described exemplaryembodiment. A processing block 32 of the present modification examplefurther includes an inspection unit 32 d in addition to the liquid filmforming unit 32 a, the drying unit 32 b and the supplying unit 32 c, asshown in FIG. 13 and FIG. 14.

The inspection unit 32 d is configured to inspect the coating state ofthe substrate W by the liquid film LF. The inspection unit 32 dincludes, for example, a weight gauge, and inspects whether theirregularity pattern of the substrate W is coated with the liquid filmLF by measuring a weight of the substrate W. The inspection unit 32 dmay include the film thickness gauge as well.

If the processing block 32 has the inspection unit 32 d, the coatingstate of the substrate W by the liquid film LF can still be inspectedbefore the supercritical drying processing even if the drying unit 32 bdoes not have the film thickness gauge 58. Here, however, the inspectionunit 32 d and the film thickness gauge 58 may be both used.

The formation of the liquid film LF, the inspection of the coatingstate, and the drying of the substrate W are performed in this sequence.Thus, when viewed from the top, the liquid film forming unit 32 a, theinspection unit 32 d and the drying unit 32 b belonging to the sameprocessing block 32 are arranged at a long side of the rectangulartransfer block 31 in a row in this sequence, as shown in FIG. 13. Withthis configuration, it is possible to perform the inspection of thecoating state while transferring the substrate W from the liquid filmforming unit 32 a to the drying unit 32 b. Thus, the transfer path ofthe substrate W can be shortened.

The processing block 32 may further include a cleaning unit 32 e, asshown in FIG. 14. The cleaning unit 32 e is configured to remove anorganic substance or the like adhering to the substrate W by radiatingultraviolet rays to the substrate W. The radiation of the ultravioletrays is performed after the drying of the substrate W to remove aremnant of the drying liquid or the supercritical fluid.

As illustrated in FIG. 14, if the cleaning unit 32 e and the inspectionunit 32 d are stacked on top of each other in the vertical direction,the footprint of the processing block 32 can be reduced. It does notmatter which of the cleaning unit 32 e and the inspection unit 32 d isplaced on top.

The number of the liquid film forming unit 32 a, the drying unit 32 b,the supplying unit 32 c, the inspection unit 32 d, and the cleaning unit32 e provided in the processing block 32 is one each. However, thekinds, the number and the layout of these units belonging to theprocessing block 32 are not particularly limited. By way of example,although the processing block 32 of the present modification exampleincludes both the inspection unit 32 d and the cleaning unit 32 e, theprocessing block 32 may include either one of them.

In case that the processing block 32 includes the cleaning unit 32 e,the liquid film forming unit 32 a, the cleaning unit 32 e and the dryingunit 32 b belonging to the same processing block 32 are arranged at along side of the rectangular transfer block 31 in a row in thissequence, when viewed from the top. With this configuration, it ispossible to perform the cleaning while transferring the substrate W fromthe drying unit 32 b to the transition device 23 a. Thus, the transferpath of the substrate W can be shortened.

Now, a second modification example of the substrate processing apparatus1 will be described with reference to FIG. 15 and FIG. 16. Below, thedescription will mainly focus on distinctive features between thepresent modification example and the above-described exemplaryembodiment. The substrate processing apparatus 1 according to thepresent modification example further includes a second processing block33 in addition to the transfer block 31 and the processing blocks 32, asshown in FIG. 15.

When viewed from the top, as shown in FIG. 15, three sides of the secondprocessing block 33 are surrounded by the transfer block 31 and twoprocessing blocks 32 which are symmetrically disposed at both sides ofthe Y-axis direction with the transfer block 31 therebetween. The secondprocessing block 33 includes an inspection unit 33 a.

The inspection unit 33 a is configured to inspect the coating state ofthe substrate W by the liquid film LF. The inspection unit 33 aincludes, for example, a weight gauge, and inspects whether theirregularity pattern of the substrate W is coated with the liquid filmLF by measuring a weight of the substrate W. The inspection unit 33 amay include the film thickness gauge as well.

If the second processing block 33 has the inspection unit 33 a, thecoating state of the substrate W by the liquid film LF can still beinspected before the supercritical drying processing even if the dryingunit 32 b does not have the film thickness gauge 58. Here, however, theinspection unit 33 a and the film thickness gauge 58 may be both used.

The processing block 32 includes multiple sets (for example, two sets)each including the liquid film forming unit 32 a, the drying unit 32 band the supplying unit 32 c, and the second processing block 33 includesmultiple (for example, two) inspection units 33 a. Here, if the multipleinspection units 33 a are stacked on top of each other in the verticaldirection as shown in FIG. 16, a footprint of the processing block 32can be reduced.

Now, a third modification example of the substrate processing apparatus1 will be explained with reference to FIG. 17 and FIG. 18. Below, thedescription will mainly focus on distinctive features between thepresent modification example and the above-described exemplaryembodiment. In the present modification example, as illustrated in FIG.17, one set of one liquid film forming unit 32 a and one drying unit 32b and another set of one liquid film forming unit 32 a and one dryingunit 32 b are arranged to be axially symmetrical with respect to animaginary line L in each same processing block 32, when viewed from thetop. Accordingly, a length of the transfer path of the substrate Wineach set becomes equal. Thus, non-uniformity in processing quality ofsubstrates W between the individual sets can be reduced.

In the present modification example, in each processing block 32, thetwo liquid film forming units 32 a are placed adjacent to each other;the two drying units 32 b are respectively placed outwardly next to thetwo liquid film forming units 32 a, and two supplying units 32 c arerespectively arranged outwardly next to the two drying units 32 b.Further, the liquid film forming units 32 a and the supplying units 32 cmay be reversely placed. That is, the two supplying units 32 c may beplaced adjacent to each other; the two drying units 32 b may berespectively placed outwardly next to the two supplying units 32 c; andthe two liquid film forming units 32 a may be respectively disposedoutwardly next to the two drying units 32 b.

In the present modification example, the inspection unit 32 d and thedrying unit 32 b are stacked on top of each other in the verticaldirection, as illustrated in FIG. 18. It does not matter which of theinspection unit 32 d and the drying unit 32 b is placed on top. If theinspection unit 32 d and the drying unit 32 b are stacked in thevertical direction, the footprint of the processing block 32 can bereduced. Further, since the inspection units 32 d are arranged to beaxially symmetrical with respect to the imaginary line L, the length ofthe transfer path of the substrate W in each set becomes equal. Thus,non-uniformity in processing quality of substrates W between theindividual sets can be reduced. The substrate W is transferred into theliquid film forming unit 32 a, the inspection unit 32 d and the dryingunit 32 b in this sequence, as indicated by arrows in FIG. 17 and FIG.18.

The inspection unit 32 d measures a weight of the substrate W after theliquid film LF is formed thereon. The weight of the substrate W beforethe formation of the liquid film LF is measured by, for example, thetransition device 23 a. In the above-described exemplary embodiment andso forth, the transition device 23 a may be configured to measure theweight of the substrate W before the formation of the liquid film LF,the same as in the present modification example. Since a weight of theliquid film LF can be calculated from a weight difference before andafter the formation of the liquid film LF, it can be inspected whetherthe irregularity pattern of the substrate W is coated with the liquidfilm LF. If the weight of the liquid film LF does not reach a thresholdvalue, an alarm or the like may be set off.

Further, the inspection unit 32 d may be disposed between the dryingunit 32 b and the liquid film forming unit 32 a when viewed from thetop, instead of being stacked on or under the drying unit 32 b. In thiscase, when viewed from the top, the liquid film forming unit 32 a, theinspection unit 32 d and the drying unit 32 b may be arranged in a rowin this sequence in the negative X-axis direction or in the positiveX-axis direction.

Now, referring to FIG. 19, a fourth modification example of thesubstrate processing apparatus 1 will be discussed. Below, thedescription will mainly focus on distinctive features between thepresent modification example and the above-described exemplaryembodiment. In the present modification example, as illustrated in FIG.19, corners of the rectangular carry-in/out station 2 are missing whenviewed from the top, and a part of the processing block 32, morespecifically, the supplying units 32 c are arranged in these missingparts. Thus, the substrate processing apparatus 1 can be scaled down.

The delivery section 23 of the carry-in/out station 2 is in contact witha short side of the rectangular transfer block 31 when viewed from thetop, and serves to deliver the substrate W to the second transfer device31 a. The processing block 32 is in contact with a long side of thetransfer block 31 and the delivery section 23. The supplying unit 32 cis in contact with the delivery section 23. Since the substrate W is notcarried into/from the supplying unit 32 c, the supplying unit 32 c maynot be in contact with the transfer block 31. Further, if the supplyingunit 32 c is in contact with the delivery section 23, there occurs noproblem regarding the transfer of the substrate W. Further, as mentionedabove, the substrate processing apparatus 1 can be scaled down.

Furthermore, in the present modification example, although eachprocessing block 32 includes the multiple sets of the liquid filmforming units 32 a and the drying units 32 b as in the thirdmodification example, only one set of the liquid film forming unit 32 aand the drying unit 32 b may be provided. By way of example, eachprocessing block 32 may include only one side (negative X-axis side) ofthe imaginary line L. In this case as well, when viewed from the top, ifa corner of the rectangular carry-in/out station 2 is missing and thesupplying unit 32 c is disposed in this missing part, the substrateprocessing apparatus 1 can be scaled down.

So far, the exemplary embodiment of the substrate processing apparatusand the substrate processing method according to the present disclosurehave been described. However, the present disclosure is not limited tothe above-described exemplary embodiment and the like. Various changes,modifications, substitutions, additions, deletions and combinations maybe made within the scope of the claims, which are all incorporatedwithin a technical scope of the present disclosure.

According to the exemplary embodiment, it is possible to scale down thesubstrate processing apparatus configured to perform the supercriticaldrying.

From the foregoing, it will be appreciated that various embodiments ofthe present disclosure have been described herein for purposes ofillustration, and that various modifications may be made withoutdeparting from the scope and spirit of the present disclosure.Accordingly, the various embodiments disclosed herein are not intendedto be limiting. The scope of the inventive concept is defined by thefollowing claims and their equivalents rather than by the detaileddescription of the exemplary embodiments. It shall be understood thatall modifications and embodiments conceived from the meaning and scopeof the claims and their equivalents are included in the scope of theinventive concept.

We claim:
 1. A substrate processing apparatus comprising a transferblock in which a transfer device configured to transfer a substrate isplaced, and a processing block provided adjacent to the transfer block,wherein the processing block comprises a liquid film forming unitconfigured to form a liquid film on a top surface of the substrate whichis held horizontally, and a drying unit configured to replace the liquidfilm with a supercritical fluid to dry the substrate, the drying unitcomprises a pressure vessel having therein a drying chamber for thesubstrate, a cover body configured to close an opening of the dryingchamber, and a supporting body configured to support the substratehorizontally in the drying chamber, the supporting body is fixed to thedrying chamber, and the transfer device advances into the drying chamberthrough the opening of the drying chamber while holding horizontally thesubstrate having the liquid film formed thereon.
 2. The substrateprocessing apparatus of claim 1, wherein when viewed from a top, theliquid film forming unit and the drying unit belonging to a sameprocessing block are in contact with a long side of the transfer blockhaving a rectangular shape, and the opening of the drying chamber isformed toward the transfer block.
 3. The substrate processing apparatusof claim 2, wherein multiple sets each including the liquid film formingunit and the drying unit are provided in the same processing block. 4.The substrate processing apparatus of claim 3, wherein when viewed fromthe top, one set of the liquid film forming unit and the drying unit andanother set of the liquid film forming unit and the drying unit arearranged axially symmetrically.
 5. The substrate processing apparatus ofclaim 1, wherein the processing block includes multiple processingblocks, and the multiple processing blocks are stacked on top of eachother in a vertical direction.
 6. The substrate processing apparatus ofclaim 5, wherein the transfer block includes multiple transfer blocks,and the multiple transfer blocks are stacked on top of each other in thevertical direction.
 7. The substrate processing apparatus of claim 1,wherein the processing block includes multiple processing blocks, andwhen viewed from a top, the multiple processing blocks are symmetricallyarranged with the transfer block therebetween.
 8. The substrateprocessing apparatus of claim 1, wherein the processing block furthercomprises an inspection unit configured to inspect a coating state ofthe substrate by the liquid film, and when viewed from a top, the liquidfilm forming unit, the inspection unit and the drying unit belonging toa same processing block are arranged at a long side of the transferblock having a rectangular shape in a row in sequence.
 9. The substrateprocessing apparatus of claim 8, wherein the processing block furthercomprises a cleaning unit configured to radiate an ultraviolet ray tothe substrate, and the cleaning unit and the inspection unit are stackedon top of each other in a vertical direction.
 10. The substrateprocessing apparatus of claim 7, further comprising: a second processingblock three sides of which are surrounded by the transfer block and twoof the processing blocks arranged at opposite sides with the transferblock therebetween, when viewed from the top, wherein the secondprocessing block comprises an inspection unit configured to inspect acoating state of the substrate by the liquid film.
 11. The substrateprocessing apparatus of claim 1, wherein the processing block comprisesan inspection unit configured to inspect a coating state of thesubstrate by the liquid film, and the inspection unit and the dryingunit are stacked on top of each other in a vertical direction.
 12. Thesubstrate processing apparatus of claim 1, further comprising: adelivery section in contact with a short side of the transfer blockhaving a rectangular shape when viewed from a top, and configured todeliver the substrate to the transfer device, wherein the processingblock further comprises a supplying unit configured to supply a fluidinto the drying unit, and the processing block is in contact with a longside of the transfer block and the delivery section, and the supplyingunit is in contact with the delivery section.
 13. A substrate processingmethod using a substrate processing apparatus comprising a transferblock in which a transfer device configured to transfer a substrate isplaced, and a processing block provided adjacent to the transfer block,wherein the processing block comprises a liquid film forming unitconfigured to form a liquid film on a top surface of the substrate whichis held horizontally, and a drying unit configured to replace the liquidfilm with a supercritical fluid to dry the substrate, the drying unitcomprises a pressure vessel having therein a drying chamber for thesubstrate, a cover body configured to close an opening of the dryingchamber, and a supporting body configured to support the substratehorizontally in the drying chamber, the supporting body is fixed to thedrying chamber, and wherein the substrate processing method comprises:forming the liquid film on the top surface of the substrate, which isheld horizontally, by the liquid film forming unit; advancing thetransfer device into the drying chamber through the opening of thedrying chamber, while holding horizontally the substrate having theliquid film formed thereon by the transfer device; receiving, in thedrying chamber, the substrate from the transfer device and holding thereceived substrate horizontally by the supporting body; retreating thetransfer device to an outside of the drying chamber through the openingof the drying chamber; closing the opening of the drying chamber by thecover body; and replacing, in the drying chamber, the liquid film withthe supercritical fluid to dry the substrate.